JPH0610717Y2 - 混成集積回路 - Google Patents
混成集積回路Info
- Publication number
- JPH0610717Y2 JPH0610717Y2 JP1986022430U JP2243086U JPH0610717Y2 JP H0610717 Y2 JPH0610717 Y2 JP H0610717Y2 JP 1986022430 U JP1986022430 U JP 1986022430U JP 2243086 U JP2243086 U JP 2243086U JP H0610717 Y2 JPH0610717 Y2 JP H0610717Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- conductive path
- integrated circuit
- hybrid integrated
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 65
- 229910052751 metal Inorganic materials 0.000 claims description 56
- 239000002184 metal Substances 0.000 claims description 56
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 230000002411 adverse Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986022430U JPH0610717Y2 (ja) | 1986-02-19 | 1986-02-19 | 混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986022430U JPH0610717Y2 (ja) | 1986-02-19 | 1986-02-19 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62135464U JPS62135464U (en]) | 1987-08-26 |
| JPH0610717Y2 true JPH0610717Y2 (ja) | 1994-03-16 |
Family
ID=30819804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986022430U Expired - Lifetime JPH0610717Y2 (ja) | 1986-02-19 | 1986-02-19 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0610717Y2 (en]) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5815374U (ja) * | 1981-07-21 | 1983-01-31 | 電気化学工業株式会社 | 回路プリント基板 |
-
1986
- 1986-02-19 JP JP1986022430U patent/JPH0610717Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62135464U (en]) | 1987-08-26 |
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